Professioneller Stylus-Oberflächenprofiler für präzise Analyse

The Professional Stylus Surface Profiler integrates advanced measurement technology with a stable and user-friendly platform, delivering precise surface characterization for modern laboratories and production environments. It offers excellent accuracy, reliable repeatability, and efficient operation, making it suitable for both research and industrial quality control applications.

Designed for high-resolution surface analysis, this system supports nanoscale roughness, step height, and 3D topography measurement. It is widely used in microelectronics, semiconductors, display manufacturing, solar energy, Medizinische Geräte, and advanced materials research, helping users achieve superior process control from R&D to final inspection.

Professional Stylus Surface Profiler – Nanometer-Level Step Height & Surface Roughness Measurement

The Professional Stylus Surface Profiler is a high-precision contact measurement system designed for accurate analysis of step height, Oberflächenrauheit, and 3D surface topography. Using a diamond stylus that gently traces the sample surface, it captures fine surface variations with exceptional resolution and stability. This ensures highly reliable and repeatable measurement results for demanding industrial and laboratory applications.

Wie es funktioniert

The system operates based on a contact-style measurement method. As the stylus moves along the surface, its vertical displacement mirrors the surface contours. This movement is captured as an electrical signal through a measuring bridge, generating an amplitude-modulated output proportional to the vertical displacement. The signal is then amplified, processed through phase-sensitive rectification, and filtered to remove noise and waviness. This ensures that the final output is a clean and stable signal, providing accurate step height and roughness measurements free from external interference and waviness.

Wichtige Anwendungen

Semiconductor Wafer Metrology: Precise measurement and analysis of semiconductor wafers to ensure high-quality fabrication.
MEMS and Microstructures: Accurate profiling of MEMS (Micro-Electro-Mechanical Systems) and microstructures for detailed surface measurements.
Thin Film and Coating Thickness: Evaluation of the thickness and uniformity of thin films and coatings, critical for various manufacturing processes.
Solar Cell Surface Profiling: Accurate surface measurements for solar cells, optimizing performance and manufacturing quality.
Precision Optics and Medical Devices: Measurement of precision optics and medical devices to maintain high standards of quality and performance.

Hauptmerkmale

Stable Performance: Ensures consistent operation with fast transmission, automatic calibration, and accurate measurement.
Revolutionary Desktop Design: Achieves a balance of high performance, ease of use, and cost-effectiveness in a compact benchtop setup.
Compact & Reliable Design: Optimized hardware configuration ensures high testing accuracy, Stabilität, and efficiency.
Superior Materials & Haltbarkeit: Crafted with high-quality materials to ensure durability, Lange Dienstzeit, and efficient performance.

Ausrüstungsmerkmale

Unrivaled Performance: Step height reproducibility below 4A, with enhanced scanning capabilities.
Single-Arch Design: Provides breakthrough stability, minimizing ambient noise interference, and enabling a large vertical range with low-force scanning.
Upgraded Smart Electronics: Reduces noise and enhances measurement accuracy, capable of measuring step heights below 10nm.
Optimized Hardware Configuration: Reduces data acquisition time by 40%, improving measurement efficiency.
64-bit Vision64 Synchronous Software: Accelerates data processing, increasing data analysis speed by 10x.
Intuitive User Interface: Vision64 software offers a simplified, user-friendly interface for easier setup and analysis.
Automatic Tip Alignment System: Simplifies probe changes with self-aligning probe assembly, reducing risks during transition.
Wide Range of Probe Models: Offers various probe sizes and shapes, ensuring compatibility with nearly any application.
Single Sensor Design: Delivers low-force measurements with a wide scanning range on a single plane.
High Throughput Testing: Ensures quick, multi-sample testing for precise thin film measurements with superior repeatability.

Technische Parameter

Messtechnik	Probe-Profiling-Technologie
Messfunktion	2D-Oberflächenprofilmessung
Messfunktion	Optionale 3D-Messung/
Beispielansicht	Selectable magnification, 1 to 4mm FOV
Sondensensor	Low inertia sensor (LIS3)
Sondendruck	Using LIS3 sensor: 1 to 15mg
Low Force (Optional)	Using N-Lite+ low force sensor: 0.03 to 15mg
Sondenoptionen	Probe curvature radius selectable range: 50nm to 25μm;
	Height-to-diameter ratio (HAR) tips: 10μm2μm and 200μm20μm;
	Custom tips are available upon request.
Beispiel X/Y-Stufe	Manual X-Y translation: 100mm (4 inches)
Beispiel X/Y-Stufe	Motorized X-Y translation: 150mm (6 inches)
Beispiel-Drehstufe	Manual, 360° rotation;
Beispiel-Drehstufe	Motorized: 360° rotation;
Computersystem	64-bit multi-core line processor, Windows* 7.0; Optional 23-inch flat panel display
Software	Vision64 operation and analysis software;
	Stress measurement software: Cantilever deflection;
	Suturing software: 3D scanning imaging software
Schwingungsdämpfungsgerät	Stoßdämpfung verfügbar
Scanlängenbereich	55mm (2 inches)
Datenpunkte pro Scan	Up to 120,000 data points
Maximale Probendicke	50mm (2 inches)
Maximale Wafergröße	200mm (8 inches)
Reproduzierbarkeit der Stufenhöhe	<4A1σ on a 1μm step
Vertikale Reichweite	1mm (0.039 inches)
Vertikale Auflösung	Maximum 1A (at 6.55μm vertical range)
Eingangsspannung	100 - 240 VAC, 50 - 60Hz
Temperaturbereich	Operating Range 20 to 25°C (68 to 77°F)
Luftfeuchtigkeitsbereich	≤80%, Non-condensing
Systemgröße und Gewicht	455 mm B x 550 mm B x 370 mm H
	(179in. W x 22.6in. D x 14.5in. H);
	34 kg (75 lbs);
	Attachment: 550mm L x 585mm W x 445mm H (216in. L x 23in. W x 175in. H);
	217 kg (48 lbs)

Anwendungsfälle

Thin Film Testing – Ensuring High Yields:
In semiconductor manufacturing, Step instrument helps monitor deposition and etching uniformity, thin film stress, and ITO thin film thickness. Its high reproducibility ensures accurate measurement, optimizing etching and deposition for better yields.
Surface Roughness Inspection – Ensuring Performance:
Ideal for assessing surface roughness in precision components across industries like automotive, Luft- und Raumfahrt, and medical devices. Zum Beispiel, it measures the roughness of orthopedic implant coatings to ensure product quality and adhesion.
Solar Grid Line Analysis – Reducing Manufacturing Costs:
Perfect for measuring the dimensions of conductive silver grid lines on solar panels. Step instrument ensures that silver usage is optimized for better conductivity, contributing to cost-saving in solar panel production.
Microfluidics Technology – Detecting Design and Performance:
Used in MEMS and microfluidics technology for qualification testing. The low-force NLite+ measurement function enables precise detection of vertical steps and roughness on photosensitive materials, ensuring design accuracy and performance.

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